Permacol 2040-Series - SMT adhesives
The PERMACOL 2040-series are thermosetting single component adhesives especially developed for SMT purposes. These epoxy-based, solvent free smooth thixotropic adhesives are optimised for (jet) dispensing and screen printing applications.
- Excellent adhesion and thermal resistance
- High green strength / non-sagging
- Fast cure
- RoHS and REACH compliant
Permacol 2510
Permacol® 2510 A/B is a 2-component epoxy adhesive with excellent heat conductivity. This adhesive has been developed to be conductive to heat only and not to electrically. For example it is used as adhesion medium on heat sinks.
The 2510 is cold curing, therefore complete curing takes place at room temperature.
Technical data
Mixing ratio A : B : 100 : 100
Colour of the mixture : White/greyish
Filling : 60-70%
Viscosity A-comp : 22 Pa.s
Viscosity B-comp : 170 Pa.s
Pot life at 23°C : ca. 5-10 min
Curing time at 23°C : ca. 3 h
Curing completed 23°C : 24 h
Density mixture : 2,11 g/cm3
Heat conductivity coefficient : ~ 1 W.m.K
Volume resistivity : > 10E14 .cm
Expansion coefficient : 95x10-6 m.K
Temp resistivity : -30 to +140°C
- Heat conductive
- Electrical insulating
- Curing at room temperature
- Little shrinkage