The use of adhesives in electronics is growing, especially in the field of bonding and fixation of electronic components. This growth is mainly due to improvements in adhesives. Properties like temperature stability, electrical conductivity, outgassing, mechanical stability, durability and workability have improved rapidly over the last few years.
Please find here the brochure Adhesives for electronics.
SMD / SMT adhesives
Bonding of SMD components on printed circuit boards. Permacol® SMD adhesives are applicable for temporary bonding of electronic components on PCB's before soldering in the solder wave. A drop of adhesive is applied either on the PCB or under the component. This will hold the two together, even before curing, due to the wet strength (green strength). Curing is done very quickly; afterwards the solder connections are made. Solder is needed for electrical contact, but is rarely required to withstand shear forces, where SMD adhesives contribute to a better fixation of the components. Important properties like viscosity and wet (green) strength make the usage of these adhesives preferable.
Electrically conductive adhesives
Applicable where electrically conductive bonding is desired. Permacol® one- or two component electrically conductive adhesives are applicable where an electrically conductive bonding is desired. Applications might include bonding lead wire to electrodes, solder paste replacement in the assembly of SMD's, die attachment and repair of conducting paths.
Besides electric, there are heath conductive adhesives for applications where it is needed, such as heat sinc or transit.
Coating, fixing and encapsulation
Casting resins (two components); In the electronic industry, insulating casting resins serve to protect circuits or components from the adverse effects of the mechanical, chemical or thermal environments in which they operate. By encapsulating an electrical / electronic unit and thereby improving the insulation between components, durability of the product will be increased. Permacol® casting resins are applicable in many different applications. Compared to adhesives, casting resins are in general not used in thin layers, but for casting, potting, encapsulation and molding applications. The main application of casting resins is to protect against adverse effects of mechanical, chemical, or thermal influences.
UV-adhesives; Permacol® 389 series UV curable adhesives are available in different viscosities and are therefore suitable for coating, fixing and encapsulation of electronic components.
Blop-top systems; Blop-top (glop-top) systems are used for coating bare IC's, which are bonded directly to PCB's, flex circuits, or other substrates.